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PCB manufacturing / CELECO
PCB manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
Discuss this application03 / Recommended equipment
Start with the material, structure, registration and production targets before selecting equipment.
Connect requirement review, equipment selection, process setup, trial production and ramp support.
- Application solution
- PCB manufacturing
- Recommended process
- 05
- Recommended equipment
- 03
Recommended process
A clear path from requirement to verification
Connect requirement review, equipment selection, process setup, trial production and ramp support.
Equipment selection
Process setup
Trial production
Ramp support
Key capabilities
Capabilities connected to the application
Organize equipment and process capability around the manufacturing result that must be controlled.
Application requirement review
Process and equipment matching
Implementation verification
Production continuity support
Recommended equipment
Platforms matched to this manufacturing route
Equipment selection is connected to the process path and can be refined during application review.
MAS
MAS
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
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NEX
NEX
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
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LDW
LDW
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
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Tell us about your application, equipment requirement or service request.