CO₂ Laser
Laser drilling equipment supported by application review, project introduction and local service.
Model
Equipment family
Application fit
Core capabilities
Built around production requirements
Equipment capability is organized around manufacturing requirements, process integration and production continuity.
Efficient dielectric material ablation
Microvia drilling for high-density interconnect structures
Controlled via profile and process window
Application verification and local lifecycle support
Implementation path
From requirement to stable production
Connect application review, process verification, equipment integration and lifecycle service as one path.
Review application
Verify process
Integrate equipment
Support production
Technical specifications
Configuration at a glance
Configuration information is managed in the CMS and may vary according to the project.
| Technical specifications | Value | Unit |
|---|---|---|
| Laser platform | CO₂ laser | — |
| Process focus | Dielectric microvia drilling | — |
| Application direction | HDI and IC substrate | — |
| Project support | Review, verification and integration | — |
Application fit
Where this equipment fits
HDI manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
IC substrate
Connect manufacturing requirements with the recommended process, equipment and implementation support.
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Discuss your process
Tell us about your application, equipment requirement or service request.