HDI manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
Application solution
Recommended process
Recommended equipment
Manufacturing challenge
Higher interconnect density requires controlled microvias, fine features and reliable layer-to-layer registration.
Start with the material, structure, registration and production targets before selecting equipment.
Connect drilling, direct imaging and verification around the HDI build-up process.
Recommended process
A clear path from requirement to verification
Connect drilling, direct imaging and verification around the HDI build-up process.
Stack review
Microvia drilling
Desmear
Direct imaging
Verification
Key capabilities
Capabilities connected to the application
Organize equipment and process capability around the manufacturing result that must be controlled.
Controlled microvia formation
Fine-line direct imaging
Reliable layer-to-layer registration
Connected process verification
Recommended equipment
Platforms matched to this manufacturing route
Equipment selection is connected to the process path and can be refined during application review.

MAS
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.

NEX
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.

CO₂ Laser
Laser drilling equipment supported by application review, project introduction and local service.

Ultrafast Laser
Laser drilling equipment supported by application review, project introduction and local service.
Related solutions
Continue through the application matrix
Explore adjacent manufacturing routes supported by the same equipment portfolio.
PCB manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
FPC manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
IC substrate
Connect manufacturing requirements with the recommended process, equipment and implementation support.
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