
HDI manufacturing / CELECO
HDI manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
Start with the material, structure, registration and production targets before selecting equipment.
Connect drilling, direct imaging and verification around the HDI build-up process.
- Application solution
- HDI manufacturing
- Recommended process
- 05
- Recommended equipment
- 04
Recommended process
A clear path from requirement to verification
Connect drilling, direct imaging and verification around the HDI build-up process.
Microvia drilling
Desmear
Direct imaging
Verification
Key capabilities
Capabilities connected to the application
Organize equipment and process capability around the manufacturing result that must be controlled.
Controlled microvia formation
Fine-line direct imaging
Reliable layer-to-layer registration
Connected process verification
Recommended equipment
Platforms matched to this manufacturing route
Equipment selection is connected to the process path and can be refined during application review.

MAS
MAS
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
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NEX
NEX
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
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CO₂ Laser
CO₂ Laser
Laser drilling equipment supported by application review, project introduction and local service.
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Ultrafast Laser
Ultrafast Laser
Laser drilling equipment supported by application review, project introduction and local service.
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