Back to solutions
IC substrate / CELECO
IC substrate
Connect manufacturing requirements with the recommended process, equipment and implementation support.
Discuss this application04 / Recommended equipment
Start with the material, structure, registration and production targets before selecting equipment.
Build a material-aware route for ABF-class films and fine-line substrate production.
- Application solution
- IC substrate
- Recommended process
- 05
- Recommended equipment
- 04
Recommended process
A clear path from requirement to verification
Build a material-aware route for ABF-class films and fine-line substrate production.
Via formation
Surface preparation
Fine-line imaging
Metrology
Key capabilities
Capabilities connected to the application
Organize equipment and process capability around the manufacturing result that must be controlled.
Material-aware process planning
Controlled microvia formation
Fine-line imaging and registration
Dimensional compensation and metrology
Recommended equipment
Platforms matched to this manufacturing route
Equipment selection is connected to the process path and can be refined during application review.
PLP
PLP
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
View product
MLC
MLC
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
View product
CO₂ Laser
CO₂ Laser
Laser drilling equipment supported by application review, project introduction and local service.
View product
UV Laser
UV Laser
Laser drilling equipment supported by application review, project introduction and local service.
View productContact us
Discuss this application
Tell us about your application, equipment requirement or service request.