CELECO / Laser drilling
UV Laser
Laser drilling equipment supported by application review, project introduction and local service.
- Model
- UV Laser
- Equipment family
- Laser drilling
- Application fit
- 02
Core capabilities
Built around production requirements
Equipment capability is organized around manufacturing requirements, process integration and production continuity.
Short-wavelength precision material processing
Controlled thermal impact for delicate structures
Microvia drilling and precision routing capability
Application verification and local lifecycle support
Implementation path
From requirement to stable production
Connect application review, process verification, equipment integration and lifecycle service as one path.
Review application
Verify process
Integrate equipment
Support production
Technical specifications
Configuration at a glance
Configuration information is managed in the CMS and may vary according to the project.
Swipe horizontally to view all specifications.
| Technical specifications | Value | Unit |
|---|---|---|
| Laser platform | UV nanosecond | — |
| Process focus | Precision drilling and routing | — |
| Application direction | FPC and IC substrate | — |
| Project support | Review, verification and integration | — |
Application fit
Where this equipment fits
FPC manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
IC substrate
Connect manufacturing requirements with the recommended process, equipment and implementation support.
Related equipment
Laser drilling
Compare other platforms in the same equipment family.
CELECO / UV Laser
Discuss your process
Tell us about your application, equipment requirement or service request.