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Laser drilling / UV Laser

UV Laser

Laser drilling equipment supported by application review, project introduction and local service.

UV Laser
UV Laser

Model

Laser drilling

Equipment family

02

Application fit

Core capabilities

Built around production requirements

Equipment capability is organized around manufacturing requirements, process integration and production continuity.

01

Short-wavelength precision material processing

02

Controlled thermal impact for delicate structures

03

Microvia drilling and precision routing capability

04

Application verification and local lifecycle support

Implementation path

From requirement to stable production

Connect application review, process verification, equipment integration and lifecycle service as one path.

01

Review application

02

Verify process

03

Integrate equipment

04

Support production

Technical specifications

Configuration at a glance

Configuration information is managed in the CMS and may vary according to the project.

Technical specificationsValueUnit
Laser platformUV nanosecond
Process focusPrecision drilling and routing
Application directionFPC and IC substrate
Project supportReview, verification and integration

Application fit

Where this equipment fits

FPC manufacturing

FPC manufacturing

Connect manufacturing requirements with the recommended process, equipment and implementation support.

IC substrate

IC substrate

Connect manufacturing requirements with the recommended process, equipment and implementation support.

Related equipment

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CELECO / UV Laser

Discuss your process

Tell us about your application, equipment requirement or service request.

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