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Advanced packaging / CELECO
Advanced packaging
Connect manufacturing requirements with the recommended process, equipment and implementation support.
Recommended equipmentCELECO / PLP01 — PLATFORM
Advanced packagingPLP / WLP / MLC
Discuss this application03 / Recommended equipment
Start with the material, structure, registration and production targets before selecting equipment.
Connect material review, alignment compensation, direct imaging and process verification for wafer-level and panel-level packaging.
- Application solution
- Advanced packaging
- Recommended process
- 05
- Recommended equipment
- 03
CELECO / TECHNOLOGY
Precision, connected across the process.
Recommended process
A clear path from requirement to verification
Connect material review, alignment compensation, direct imaging and process verification for wafer-level and panel-level packaging.
Material and process matching
Alignment and compensation
Direct imaging
Sample and process verification
Key capabilities
Capabilities connected to the application
Organize equipment and process capability around the manufacturing result that must be controlled.
Adaptive alignment
Dynamic autofocus
Digital position compensation
Integrated scanning alignment and imaging
Recommended equipment
Platforms matched to this manufacturing route
Equipment selection is connected to the process path and can be refined during application review.
PLP
PLP
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
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WLP
WLP
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
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MLC
MLC
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
View productCELECO / ADVANCED PACKAGING
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