CELECO / Direct imaging
WLP
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
- Model
- WLP
- Equipment family
- Direct imaging
- Application fit
- 01
Core capabilities
Built around production requirements
Equipment capability is organized around manufacturing requirements, process integration and production continuity.
Application-fit equipment evaluation
Process integration and project introduction
Installation, commissioning and lifecycle support
Implementation path
From requirement to stable production
Connect application review, process verification, equipment integration and lifecycle service as one path.
Review application
Verify process
Integrate equipment
Support production
Application fit
Where this equipment fits
Advanced packaging
Connect manufacturing requirements with the recommended process, equipment and implementation support.
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CELECO / WLP
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